Eliminates the use of cyanide strike coats.
Eliminates the use of Pot Metal Primer on Zinc
Eliminates the use of Nickel Strike on Steel prior
to copper plating
Increases the bond of acid copper, Nickel and
Copy Chrome™ to all substrates
Flash Copper™ is a unique alkaline electrolytic
copper plating process with covering
and throwing powers greater than cyanide copper.
Flash Copper™ is an outstanding pre-plate copper strike for bright nickel, acid copper,
tin and solder plates. It is an excellent heat treat stop off plate and EMI shield.
It is also an excellent decorative finish for buttons, rivets, lighting fixtures and builders’
hardware. The copper plate can be readily blackened or oxidized for a variety of attractive
antiqued finishes.
1.5 Gallon
1 x 2 Gallon Plating Tank & Lid
Flash Copper™ Part A - 2 Quarts
Flash Copper™ Part B - 1 Pint
Flash Copper™ Part C - 1 Pint
2 x 4" x 8" Copper Anodes and bandages
1 x 100w 100°F Heater
The Complete Plating Manual
Free Technical Support
3 Gallon
1 x 3.5 Gallon Plating Tank & Lid
Flash Copper™ Part A - 4 Quarts
Flash Copper™ Part B - 1 Quart
Flash Copper™ Part C - 1 Quart
2 x 4" x 8" Copper Anodes and bandages
1 x 300w 100°F Heater
The Complete Plating Manual
Free Technical Support
4.5 Gallon
1 x 6 Gallon Plating Tank & Lid
Flash Copper™ Part A - 6 Quarts
Flash Copper™ Part B - 3 pints
Flash Copper™ Part C - 3 pints
2 x 4" x 8" Copper Anodes and bandages
1 x 300w 100°F Heater
The Complete Plating Manual
Free Technical Support
There are no carbonates to be treated. It contains no strong chelators.
It is supplied as a liquid concentrate, which is diluted with water.
Flash Copper™ produces a fine grained, smooth, dense and ductile copper deposit,
which is nonporous and has excellent bonding properties. The throwing and covering
power of the non-cyanide process is superior to cyanide processes. This is especially
evident in barrel plating. It has uniform low current density distribution with excellent
micro-throw.
The grain is smaller than cyanide copper, which increases the density of the deposit.
This density provides excellent heat treat stop off and masking properties. The fine-grained
Flash Copper™ deposit under nickel/chrome improves the overall corrosion resistance and
helps to throw the nickel farther into the low current density areas.
Flash Copper™ produces a softer and more ductile deposit than cyanide or acid copper.
The soft deposit imparts improved adhesion and corrosion resistance and greatly improved
resistance to thermal shock. It has a high deposit purity and hence no out-gassing with
subsequent brazing, soldering or vacuum operations.
Flash Copper™ is simple and inexpensive to use because it replenishes the copper in solution
by dissolving the copper anode and here again it is a unique product with only one maintenance additive.
Flash Copper™ Benefits
One solution serves as both a strike and a plate bath.
Greater throwing power than acid copper
Eliminates the inherent dangers of cyanide in the work
place and improves employee health and safety.
Flash Copper™ has excellent bath stability and high efficiency.
The bath does not have to be dumped as with other baths due
to breakdown products or iron buildup.
The bath is easily maintained by monitoring the pH and copper
metal concentration.
It has a very wide operating window.
Flash Copper™ is supplied as a liquid concentrate, which is diluted
with an equal amount of distilled water.
