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Flash
Copper Plating Kit
DOES THE IMPOSSIBLE - Plates Directly
onto POT METAL, STEEL, ZINC, BRASS, ZINCATED ALUMINUM, ELECTROLESS
NICKEL, AND COPPER

- Eliminates the use of cyanide strike coats.
- Eliminates the use of Pot Metal Primer on Zinc
- Eliminates the use of Nickel Strike on Steel prior to copper
plating
- Increases the bond of acid copper, Nickel and Copy Chrome™
to all substrates
Flash Copper™ is a unique alkaline electrolytic copper plating
process with covering and throwing powers greater than cyanide copper.
Flash Copper™ is an outstanding pre-plate copper strike for
bright nickel, acid copper, tin and solder plates. It is an excellent
heat treat stop off plate and EMI shield.
It is also an excellent decorative finish for buttons, rivets,
lighting fixtures and builders’ hardware. The copper plate
can be readily blackened or oxidized for a variety of attractive
antiqued finishes.
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1.5 Gallon
- 1 x 2 Gallon Plating Tank & Lid
- Flash Copper™ Part A - 2 Quarts
- Flash Copper™ Part B - 1 Pint
- Flash Copper™ Part C - 1 Pint
- 2 x 4" x 8" Copper Anodes and bandages
- 1 x 100w 100°F Heater
- The Complete Plating Manual
- Free Technical Support
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3 Gallon
- 1 x 3.5 Gallon Plating Tank & Lid
- Flash Copper™ Part A - 4 Quarts
- Flash Copper™ Part B - 1 Quart
- Flash Copper™ Part C - 1 Quart
- 2 x 4" x 8" Copper Anodes and bandages
- 1 x 300w 100°F Heater
- The Complete Plating Manual
- Free Technical Support
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4.5 Gallon
- 1 x 6 Gallon Plating Tank & Lid
- Flash Copper™ Part A - 6 Quarts
- Flash Copper™ Part B - 3 pints
- Flash Copper™ Part C - 3 pints
- 2 x 4" x 8" Copper Anodes and bandages
- 1 x 300w 100°F Heater
- The Complete Plating Manual
- Free Technical Support
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There are no carbonates to be treated. It contains no strong chelators.
It is supplied as a liquid concentrate, which is diluted with water.
Flash Copper™ produces a fine grained, smooth, dense and
ductile copper deposit, which is nonporous and has excellent bonding
properties. The throwing and covering power of the non-cyanide process
is superior to cyanide processes. This is especially evident in
barrel plating. It has uniform low current density distribution
with excellent micro-throw.
The grain is smaller than cyanide copper, which increases the density
of the deposit. This density provides excellent heat treat stop
off and masking properties. The fine-grained Flash Copper™
deposit under nickel/chrome improves the overall corrosion resistance
and helps to throw the nickel farther into the low current density
areas.
Flash Copper™ produces a softer and more ductile deposit
than cyanide or acid copper. The soft deposit imparts improved adhesion
and corrosion resistance and greatly improved resistance to thermal
shock. It has a high deposit purity and hence no out-gassing with
subsequent brazing, soldering or vacuum operations.
Flash Copper™ is simple and inexpensive to use because it
replenishes the copper in solution by dissolving the copper anode
and here again it is a unique product with only one maintenance
additive.
Flash Copper™ Benefits
- One solution serves as both a strike and a plate bath.
- Greater throwing power than acid copper
- Eliminates the inherent dangers of cyanide in the work place
and improves employee health and safety.
- Flash Copper™ has excellent bath stability and high efficiency.
The bath does not have to be dumped as with other baths due to
breakdown products or iron buildup.
- The bath is easily maintained by monitoring the pH and copper
metal concentration.
- It has a very wide operating window.
- Flash Copper™ is supplied as a liquid concentrate, which
is diluted with an equal amount of distilled water.
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